doosan

Doosan solus supplies high-end copper foil
based on foundation technique of ultra thin foil and coating.

Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Doosan Solus is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.

Business information

Doosan solus supplies high-end copper foil based on foundation technique of ultra thin foil and coating.

Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Doosan Solus is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.

Strength

Copper foil

Holding copper foil technology for 5G that can minimize signal loss
Copper foil for low signal loss that minimizes signal loss using the technology of forming less than 1.0um illumination (Based on Rz JIS); applied to network applications such as 5G
High-end copper foil for electric vehicle batteries with high strength/high elongation
Secured copper foil implementation technology for high-strength, high-elongation batteries and thin foil mass production that can satisfy the manufacturing methods and requirements of various battery customers
Holding the world’s leading thin foil manufacturing technology
Manufacturing less than 2um ultra-thin foils, having manufacturing methods suitable for making high-end PCB (Electronic circuit board) micro-circuit, highly sensitive and integrated, and multi-layered
Holding copper foil technology for the IC/USIM card
Providing copper foils suitable for IC cards and USIM cards using special surface treatment technology to prevent damage from external environment such as moisture, including copper foil manufacturing technology with high strength and high elongation

Product applications

  • For high-frequency circuits
    (Antenna, Etc.)
  • For IC and USIM cards
  • Flexible substrate
    (Smart phone, Etc.)
  • High-speed digital transmission
    & low loss
    (5G communication equipment,
    base station radar, Etc.)
  • Lithium-ion battery
    (for electric vehicles)
  • High-performance
    multi-layered board
    (Network board)

Main Product

  • Copper foil for electric vehicle batteries (SR-PLSP)
    • High-elongation electrolyte copper foil
    • Applied to next-generation lithium-ion batteries for electric vehicles (Cylinder/square type)
    • Thickness: 6~12um
  • Ultra-low-illumination copper foil (BF-NN)
    • Low surface roughness
      • Stable peel strength (over 0.5N/mm) at roughness of below 0.9um (JIS standard)
    • Used for data sensor, etc. with low Insertion loss even at 77Ghz
    • Thickness: 9~70um
  • Ultra-thin foil (DOUBLETHIN™)
    • The 1.5um~5um thin product can be used for IC Packaging and HDI application.
    • Can be used for Modified Semi-Additive Process, applicable at Line Space of 30/30um and below.
    • Thickness: 1.5~5um

Manufacturing process

  1. 1. Raw material
    High-purity raw materials received
  2. 2. Dissolving
    Process of preparing electrolyte for plating
  3. 3. Plating
    Process of producing copper foil of uniform thickness by plating Cu ion on drums in electrolyte solution
  4. 4. Treating
    Process of roughening the copper foil surface and enhancing performance through coating and other treatment
  5. 5. Slitting & Sheeting
    Slitting in the width direction of the copper foil according to customer demand size
  6. 6. Inspection & Shipping
    Process of packing and shipping after quality inspection

Product classification

major product description
Product name Products by Application Type Characteristic
TZA Conventional multilayer laminate Enhanced high temperature elogation
TZA-B Middle and low loss signal application Reverse treatment type and low roughness
TWS High Tg and engineering plastic laminate High bonding strength at BT resin base prepreg
TWLS Very low Dk laminate High bonding strength at low Dk prepreg
SR-TZA-B-FX Flexible application High flexural ductility property with low roughness
BF-TZA-FX Flexible application Flexural ductility property and high bonding strength with PI film
LPT-YE Smart Card / Tape Carrier Substrate Superior elastic modulus and high mechanical property
Doublethin™ IC packaging and Advanced HDI for the fine patterning Very thin foil (minimum 1.5um) with carrier foil
BF-HFZ Ultra high-Frequency application Good bonding strength with fluoropolymer resin system and low roughness
BF-TZA & BF-HFI-LP2 High speed digital application Good bonding strength with very low loss laminate and very low roughness
BF-ANP Ultra high speed digital application Almost free profile with good bonding strength

Contact information

Battery copper foil

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Electro Materials

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